Method for forming radio frequency antenna

ABSTRACT

A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.

CLAIM OF PRIORITY

This application is a continuation in part of U.S. patent applicationSer. No. 10/925,229 filed Aug. 24, 2004, which is a continuation in partof U.S. patent application Ser. No. 10/238,598 filed Sep. 11, 2002,which is a continuation of U.S. patent application Ser. No. 09/524,505filed Mar. 13, 2000.

BACKGROUND OF THE INVENTION

The present invention relates to methods of manufacture of flexiblecircuits used in construction of radio frequency (RF) antennae.

Radio frequency antennae are typically made in a conductive coilpattern. The conductive coil pattern allows the antenna to receive andradiate energies in the radio frequency range. Typically, the antenna isoptimized to transmit and receive energy in a relatively narrow portionof the radio frequency range.

Radio frequency antennae are used in a number of different areasincluding inventory control. Often the radio frequency antenna isconnected to an integrated circuit. The integrated circuit receivesenergy from a detector unit, modulates the energy with an identificationpattern stored in the integrated circuit, and then retransmits themodulated energy to the detector unit. Such inventory control units,including the radio frequency antennae, can be made quite inexpensively.

One way of forming a radio frequency antenna is to stamp out aconductive coil out of a sheet of metal. The downside of this method isthat the production of the metal coil results in a large amount of scrapmetal. Additionally, the radio frequency antennae produced by stampingfrom a sheet of metal may be stiffer than desired.

Another way of forming the radio frequency antenna is to use strip-backtechniques common in printed circuit (PC) board fabrication. In PC boardfabrication, a layer of the conductive material is formed on top of asubstrate, and the areas not used for the antenna are stripped away.This method tends to be wasteful when used to produce the radiofrequency antenna, because the radio frequency coil antenna tends to beabout 10% of the surface area of the substrate. This compares tocoverage areas of 70-80% common with typical PC board implementations.

Another way of forming a radio frequency antenna is to use conductiveinks. Typically, the conductive ink is printed in a RF antenna coilpattern on top of the substrate. The conductive ink is then cured. Theprinted antennae may be used as is or electrodes are attached to theconductive ink pattern and a metal layer is electroplated on top of theconductive ink pattern. FIG. 1 illustrates this prior art embodiment.The electrode is attached pad 22 to electroplate the metal material ontop of the conductive ink pattern. Because of its cost, the conductiveink material tends to be applied in relatively narrow and thin layers.This means that when a voltage source is attached to pad 22, there isconsiderable electrical resistance between pad 22 and point 24 near thecenter of the pattern. Due to this electrical resistance, theelectroplated material preferentially coats the areas near the electrodeat pad 22, rather than position 24. This makes it difficult to obtain aproper electroplated coating on top of the conductive ink.

One possible solution is to use the conductive ink with a thicker orwider pattern, thus reducing the resistance per length of the conductiveink strip. The downside of this solution is that the conductive ink isexpensive compared to the much cheaper electroplated material.

For the above reasons, it is desired to have an improved method offorming a radio frequency antenna.

SUMMARY OF THE PRESENT INVENTION

The present invention is a method and apparatus of forming a flexiblecircuit for use as a radio frequency antenna which uses a temporaryelectrical-short layer. In one embodiment of the present invention, aseed layer, such as a conductive ink layer, is formed in the coilantenna pattern on a substrate. An electrical-short layer pattern of aconductive material is placed over the coils, such that the coil iselectrically shunted together. An insulating layer is formed over top ofthe electrical-short layer. Next, electroplating occurs, so that theelectroplated material forms over top of the conductive ink material.The electrical-short layer and the insulating layer are then removed.

The use of the electrical-short layer has the advantage that it allowsthe resistance between the electrode and the other locations on theconductive ink layer to be reduced. The electrical-short layereffectively results in a more uniform electroplating on all the pointson the radio frequency coil pattern. This avoids the problem thatoccurred in the prior art of requiring a relatively thick conductive inklayer. In the method of the present invention, an effectively uniformconductive electroplate layer can be produced.

Another embodiment of the present invention is a radio frequencyantenna, which is formed by the method of the present invention. Thisradio frequency antenna includes a substrate, a conductive ink layer inthe form of an antenna coil, and a conductive electroplate layer on topof the conductive ink layer, with the conductive electroplate layerhaving a removed short region. The removed short region comprises aportion of the seed layer not covered by the conductive material, orcomprises a portion of the seed layer wherein the conductive layer isthinner than the remaining portions. Another embodiment of the presentinvention comprises a method for forming a radio frequency antenna. Themethod comprises: providing a substrate layer; forming one or more holesin the substrate layer; attaching a conductive foil layer on one or bothsides of the substrate layer, such that the conductive foil covers theholes; and forming conductive layer(s) on one (both) sides of thesubstrate in an antenna coil pattern, with the conductive ink to form anelectric contact with the metal foil. The conductive ink has theadvantage that it can easily go into the holes to form that connectionto a conductive foil and the circuit elements on the substrate. Priorways of forming a connection between two sides of the substrate for theradio frequency antenna include punching holes through a conductivemetal layer to a conductive metal layer on the other side of thesubstrate. The punch would hopefully force some metal on the one layerto contact the metal on the other layer. This has the downside of itbeing unreliable and prone to failure during the operation of the radiofrequency antenna.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram, of a prior art radio frequency antenna.

FIG. 2 is a diagram illustrating the construction of the radio frequencyantenna of the present invention using an electrical-short layer.

FIG. 3 is a detail of a top view of the electrical-short layer placed ontop of the loops of the conductive ink coil pattern of one embodiment ofthe present invention.

FIGS. 4A-4E are cross-sectional diagrams illustrating the constructionof the radio frequency antenna according to one embodiment of thepresent invention.

FIG. 5 illustrates a detail of one embodiment of a radio frequencyantenna constructed by the method of one embodiment of the presentinvention.

FIG. 6 is a flow chart illustrating one method of the present invention.

FIGS. 7A-7C are diagrams illustrating the construction of a radiofrequency antenna according to another embodiment of the presentinvention.

FIGS. 8A-8D are cross-sectional diagrams illustrating the constructionof one embodiment of the radio frequency antenna according to FIGS.7A-7C.

FIGS. 9A-9C are diagrams illustrating the construction of a radiofrequency antenna according to one embodiment in which portions of thebond pads are not covered by a conductive layer.

FIG. 10 illustrates an example where an antenna web, includes a numberof antennas. The seed layer can be laid down as shown in the hatchedregion.

FIG. 11 shows an exemplary antenna with removed short regions.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 2 is a top view of a radio frequency antenna 40 being constructedby the method of one embodiment of the present invention. The radiofrequency antenna 40 includes a conductive ink pattern 42 formed in acoil on the substrate 44. An electrical-short layer 46 is formed overtop of the conductive ink coil pattern, and preferably a nonconductiveplating resist is formed over the short. The electrical-short layer 46ensures that points 48, 50 and 52 on the conductive ink pattern 42 willhave relatively similar voltages during the electroplating process. Thismeans all locations on the conductive ink pattern 42 will beelectroplated evenly. Thus the apparatus of the present invention allowsfor a conductive electroplate layer of sufficient thickness on allpoints of the radio frequency antenna.

The use of the electrical-short layer 46 allows for the use of a thinnerand/or narrower conductive ink layer 42. The resistance of theconductive ink layer during the electroplate process is not as importantof a factor because the electrical-short layer is used.

Typically it is desired to minimize the resistance of the radiofrequency antenna. A desirable property of radio frequency antennae isto have a relatively high Q factor. The Q factor for an antenna isdefined as the imaginary over the real part of the impedance. Theimaginary part of the impedance is typically a function of the desiredoperating frequency and geometry and is typically fixed. Thus, toproduce a high Q factor antenna, the resistance of the antenna should bekept as small as possible. This means that it is desired to have arelatively thick conductive metal layer forming the coils of the radiofrequency antenna. The use of the electrical-short layer of the presentinvention aids in the construction of a uniformly thick electroplatelayer, thus lowering the resistance and raising the Q factor.

FIG. 3 is a detail of a portion of FIG. 2.

FIGS. 4A-4E are cross-sectional views illustrating the construction ofone embodiment of the radio frequency antenna of the present invention.In FIG. 4A, a conductive seed layer 50 is formed on top of the substrate52. In the preferred embodiment, the substrate 52 is a flexiblesubstrate which allows the constructed radio frequency antenna to bend.One example of a flexible substrate material which is suitable for usewith the present invention is Mylar.RTM., polyester film from E.I.DuPont de Nemours, Wilmington Del. A conductive seed layer 50 is formedin a coil pattern shown with respect to FIG. 2 above. In one embodimentof the present invention, the conductive seed layer 50 is a conductiveink layer. The conductive ink layer could be of the type such asEnTouch.™. EN-079 from Engelhard Corporation Iselin N.J. In FIG. 4B, theelectrical-short layer material 54 is formed over top of the coilpattern 50. The electrical short ink layer could be of the type such asEnTouch.™. EN-081 from Engelhard Corporation Iselin N.J. An additionalinsulating layer 56 is preferably formed on top of the electrical-shortlayer 54. The insulating ink layer could be of the type such asEnTouch.™. EN-080 from Engelhard Corporation Iselin N.J. The conductiveink layer 50 can be printed upon the flexible substrate, as is known inthe prior art. In one embodiment, the electrical-short layer 54, and theinsulating layer, 56 are differentially removable (for example solublein a solvent that the initial seed layer is impervious to) from theconductive ink material. FIG. 4C illustrates the results of theelectroplating, in which a conductive material 58 is formed over top ofthe conductive ink layer 50. The insulating layer 50 preferably preventsan electroplate layer from forming on the electrical-short layer. Theconductive layer 58 is preferably an inexpensive metal material. In oneembodiment of the present invention, the conductive layer 58 is made ofcopper. In FIG. 4D, the electrical-short layer 54 and the insulatinglayer 56 are stripped away. The stripping can be done using a solvent,ashing, reactive gas or any other method.

In an alternate embodiment of the present invention, theelectrical-short layer 54 is constructed of metallic foil, which couldbe attached to the RF antenna and then removed after the electroplating.FIG. 4E shows an optional additional step of a second electroplating inwhich an additional electroplate layer 60 is formed on top of the firstelectroplate layer 58. The advantage of the second electroplate step isthat it allows for some electroplate material to go into the removedshort layer region 62.

FIG. 5 illustrates a detail of the formed radio frequency antennaproduced with the method of one embodiment of the present invention.Note that most of the radio frequency antenna includes electroplatedcopper portions 70, but the small removed electrode portion 72 consistsof the conductive ink layer by itself. As long as the removed shortregion 72 remains relatively thin, the total increased resistance causedby the removed short region 72 will not be too high. In fact, the totalresistance of the radio frequency antenna is reduced as a result of themore effective electroplating of the present invention.

FIG. 6 is a flow chart illustrating one embodiment of the presentinvention. In Step 80, a flexible substrate is provided. In Step 82, acoil antenna pattern is formed on the substrate with the conductive ink.In Step 84, the conductive ink is cured. In Step 86, an electrical-shortlayer is formed over a portion of the coil pattern. In a preferredembodiment, the electrical-short layer is formed of differentiallyremovable conductive ink. In Step 88, an insulating layer is formed overthe electrical-short layer. In Step 90, the electroplating is done toform a conductive electroplate layer on the conductive ink layer. InStep 92, the electrical-short layer and insulating layer are removed.This is preferably using a solvent that removes the electrical-shortlayer and insulating layer, yet does not affect the cured conductive inklayer. Step 94 is an optional second electroplating step.

FIGS. 7A-7C illustrate another embodiment of the present invention. InFIG. 7A, a flexible substrate 100 is provided. Holes 102 and 104 arepunched into the flexible substrate material 100. Looking at FIG. 7B, aconductive foil 106 is attached over holes 102 and 104. FIGS. 7A and 7Bare shown with side 100 a of the flexible substrate 100 shown on top. InFIG. 7C, the flexible substrate 100 is flipped to the other side 100 b.In this side, the conductive ink layer 110 forms a coil pattern. Theshunt 106 on side 100 a of the flexible substrate 100 allows that thepads 112 and 114 can be adjacent to one another for easy connection tothe integrated circuit (IC) (Not shown). By using the metal foil shunt106, the loops of the coil pattern on the radio frequency antenna neednot be positioned between pads 112 and 114. Next, an electroplating stepcan be done to form an electroplated conductive layer on top of theconductive ink coil pattern.

The conductive ink material easily flows inside relatively small holesused to connect between the conductive shunt 106 and the top side of theflexible substrate 100.

FIGS. 8A-8D are cross-sectional views illustrating the construction ofthe system FIGS. 7A-7C. FIG. 8A illustrates the flexible substrate 100.In FIG. 8B, a hole 102 is formed in the flexible substrate 100. In FIG.8C, the conductive foil material 106 is connected to the substrate 100.In one embodiment, a conductive adhesive 108 can be used to hold themetal foil material 106 to the substrate 100. FIG. 8B is shown with theconductive ink material 110 which enters the hole 102 to form anelectrical contact with the shunt 106. The electrically conductive inkmaterial easily flows into the hole 102. Note that the use of a shuntmay make non-plated ink antennae feasible. In one embodiment, the use ofthe shunt allows the resistance of the antenna to be reduced which canmake it feasible to use a non-plated conductive ink layer. The shuntalso allows for the conductive antenna coil pattern to be formed on bothsides of the substrate layer, allowing for a thicker printed pattern. Inone embodiment, only a single hole is used. One example of thisembodiment is a system with an internal capacitor in the substrate layerforming a return path.

FIGS. 9A-9C illustrate an example, which a portion of the bond pads arenot covered by the conductive layer. In one embodiment, the uncoveredbonds pads allow for a better connection to an integrated circuit.

FIG. 9A illustrates the construction of a seed layer antenna patternincluding the bond pads 140 and 142 and the antenna pattern 144. Asshown in FIG. 9B in one embodiment a removable shunt 150 is placed overthe pattern 144. As shown in FIG. 9C, a removable insulating layer 152,154 and 156 can be placed over at least a portion of the bond pads andshunt. The uncovered portion of the antenna pattern can then be platedwith a conductive layer in a manner described above.

FIG. 10 illustrates an example where an antenna web 200, includes anumber of antennas 202, 204, and 206. The seed layer can be laid down asshown in the hatched region. Shunts and resist can be placed in regions,such as region 208, connected to the seed layer connector regions, suchas connector region 210, separate from the antennas can be used toreduce the required size of the shunt and resist. The uncovered portionof the antenna pattern can then be plated with a conductive layer in amanner described above. In one embodiment, multiple antennas can beplated at the same time.

In one embodiment, when the shunts and the resist are removed, theantennas 202, 204 and 206 are electrically isolated. The antennas 202,204 and 206 can then be tested independently before they are removedfrom the antenna web 200. This can provide significant commercial value.

One embodiment of the present invention is an RF antenna comprising of asubstrate layer and a seed layer on top of the substrate in an antennacoil pattern. The seed layer includes bond pads. A conductive layer isportioned over portions of the antenna coil pattern. The conductivelayer in one embodiment does not cover at least a portion of the bondpad.

In one embodiment, the conductive layer does not cover any portion ofthe bond pad. The antenna can have a removed short region across theantenna coil pattern. The removed short region can comprise a portion ofthe seed layer not covered by the conductive material or comprise aportions of the seed layer where the conductive layer is thinner thanthe remaining portion of the conductive layer. A integrated circuit canbe connected between the bond pads to form a RFID system. The seed layercan comprise cured conductive ink layer.

One embodiment of the present invention is an antenna web comprising asubstrate layer; a seed layer on top of the substrate; and a conductivelayer over portions of the seed layer.

The antenna web can have multiple antennas including the seed layer andthe conductive layer. The multiple antenna can have a removed shortregion. The removed short region can comprise a portion of the seedlayer not covered by the conductive material or comprising a portion ofthe seed layer wherein the conductive layer is thinner than theremaining portions of the conductive layer. FIG. 11 shows an exemplaryantenna 214 with removed short regions 216, 218, 220 and 222.

The seed layer can comprise a cured conductive ink layer. The removedshort region can comprises a portion of the seed layer not covered byconductive material. The removed short region can comprise a portion ofthe seed layer. The conductive layer can be thinner than the remainingportions of the electroplated conductive layer. In one embodiment, theremoved short region can include a single electroplated layer while theremaining portions of the conductive layer comprises two electroplatedlayers. The antenna web can include connector regions electricallyisolated from the antennas.

One embodiment of the present invention is a method of forming antennaweb. In one embodiment a substrate layer is provided, a seed layer canbe formed on top of the substrate, the seed layer can include multipleantenna regions. An electrical-short layer can be formed between antennaregions. The electrical-short layer can be used to electroplate aconductive layer over multiple antenna regions. The electrical-shortlayer can be removed the electrical-short layer.

The seed layer can comprise a conductive ink layer. The conductive inklayer can be cured. A non-conductive layer can be formed over top of theelectrical-short layer before the electroplating step. The removing stepcan comprise using a solvent to remove the electrical-short layer. Theelectrical-short layer can be differentially removable from the seedlayer. The substrate layer can be flexible.

In one embodiment, removing the electrical-short layer can form multipleantennas that are electrically isolated. The multiple antennas can betested while they are still on the antenna web.

The multiple antennas can be separated after testing, and can beattached to ICs by bond pads of the multiple antennas.

The above description is meant to be exemplary only. Additional ways ofimplementing the invention are done within the scope of the presentinvention, which is to be limited only by the appended claims.

1. An antenna web comprising: a substrate layer; a seed layer on top ofthe substrate; a conductive layer over portions of the seed layer,wherein the antenna web has multiple antennas including the seed layerand the conductive layer, the multiple antennas having a removed shortregion comprising a portion of the seed layer not covered by theconductive material or comprising a portion of the seed layer whereinthe conductive layer is thinner than the remaining portions of theconductive layer.
 2. The antenna web of claim 1 wherein the seed layercomprises a cured conductive ink layer.
 3. The antenna web of claim 1wherein the removed short region comprises a portion of the seed layernot covered by conductive material.
 4. The antenna web of claim 1wherein the removed short region comprises a portion of the seed layerwherein the conductive layer is thinner than the remaining portions ofthe electroplated conductive layer.
 5. The antenna web of claim 4wherein the removed short region includes a single electroplated layerwhile the remaining portions of the conductive layer comprises twoelectroplated layers.
 6. The antenna web of claim 1 wherein antenna webincludes connector regions electrically isolated from the antennas.
 7. Amethod of forming antenna web, comprising: providing a substrate layer;forming a seed layer on top of the substrate, the seed layer includingmultiple antenna regions; forming an electrical-short layer betweenantenna regions; using the electrical-short layer to electroplate aconductive layer over multiple antenna regions; removing theelectrical-short layer.
 8. The method of claim 7 wherein the seed layercomprises a conductive ink layer.
 9. The method of claim 8 wherein theconductive ink layer is cured.
 10. The method of claims 7 wherein anon-conductive layer is formed over top of the electrical-short layerbefore the electroplating step.
 11. The method of claim 7 wherein theremoving step comprises using a solvent to remove the electrical-shortlayer.
 12. The method of claim 7 wherein the electrical-short layer isdifferentially removable from the seed layer.
 13. The method of claim 7wherein the substrate layer is flexible.
 14. A method of forming antennaweb, comprising: providing a substrate layer; forming a seed layer ontop of the substrate, the seed layer including multiple antennaeregions; forming an electrical-short layer between antenna regions;using the electrical-short layer to electroplate a conductive layer overmultiple antenna regions; removing the electrical-short layer so as toform multiple antennas that are electrically isolated; and testing themultiple antennas while they are still on the antenna web.
 15. Themethod of claim 14 wherein the seed layer comprises a conductive inklayer.
 16. The method of claim 15 wherein the conductive ink layer iscured.
 17. The method of claims 14 wherein a non-conductive layer isformed over top of the electrical-short layer before the electroplatingstep.
 18. The method of claim 14 wherein the removing step comprisesusing a solvent to remove the electrical-short layer.
 19. The method ofclaim 14 wherein the electrical-short layer is differentially removablefrom the seed layer.
 20. The method of claim 14 wherein the substratelayer is flexible.
 21. The method of claim 14, further comprisingseparating the multiple antennas after testing.